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Technical Data

3M ? Anisotropic Conductive Film 7371

November 2013

Product Description

3M? Anisotropic Conductive Film (ACF) 7371 is a heat-

bondable, electrically conductive adhesive film. The

unbonded film is slightly tacky at room temperature and

consists of a thermoset-elastomer and thermoplastic

adhesive matrix randomly loaded with conductive

Typical Physical Properties and

Performance Characteristics

Note: The following technical information and data should

be considered representative or typical only and

should not be used for specification purposes.

Design Requirements

particles. These particles allow interconnection of circuit

lines through the adhesive thickness, but are spaced far

enough apart for the product to be electrically insulating

in the plane of the adhesive. Application of heat and

pressure causes the adhesive to flow and to bring the

circuit pads into contact by trapping the conductive

particles. The adhesive rapidly cross-links at modest

bonding temperature and pressure. 3M ACF 7371 may

Property

Minimum Space Between

Conductors

Minimum Pitch

Minimum Pad Area

Ambient Physical Properties

Value

100

(4)

200

(8)

0.1

(160)

Units

micron

(mil)

micron

(mil)

sq. mm

(sq. mil)

be used to bond a flexible printed circuit to another

flexible printed circuit or to a plastic touch screen or

plastic flat panel display device.

Construction

General Properties

Property (1)

Interconnect

Resistance

Interconnect

Resistance

Peel Strength

Test Substrates

Flex-to-

PC board (2)

Flex-to-

Ag-Ink/PET (4)

Flex-to-

ITO/PET (5)

Value Test Method

< 20 mOhms 3M TM-2314 (3)

> 700 gf/cm 3M TM-2313 (6)

Property

Adhesive Type

Particle Type

Value

Thermosetting Type

Gold-Coated Polymer

Peel Strength

Flex-to-

Ag-Ink/PET (4)

Flex-to-

bare-PET (7)

> 600 gf/cm 3M TM-2313 (6)

> 900 gf/cm 3M TM-2313 (6)

Particle Size

10 micron

Liner Type

Adhesive Thickness

Liner Thickness

Polyester Film with Silicone Release

25 micron

50 micron

(1)

(2)

(3)

For a given application, values may differ depending on particular substrate

material or type of circuitry.

Measured for gold/nickel/copper polyimide flex circuits bonded to printed

circuit board. Contact overlap area was 0.38 sq. mm. Pad pitch was 500

microns.

3M internal test method TM-2314 based on IPC 650 - Section 2.6.24. The

flex has the shorting strap located near the bond-line to approximate a

4-wire test structure and eliminate most extraneous resistance in the

measurement due to the circuit lines.

(4)

(5)

(6)

(7)

Measured for gold/nickel/copper polyimide flex circuits bonded to silver-

ink/indium-tin-oxide/polyester. Contact overlap area was 2.0 sq. mm. Pad

pitch was 2 mm.

Measured for gold/nickel/copper polyimide flex circuits bonded to indium-

tin-oxide/polyester. Flex circuit pitch was 500 microns.

3M internal test method TM-2313 based on IPC 650 - Section 2.4.9.1.

Measured for gold/nickel/copper polyimide flex circuits bonded to bare

polyester. Flex circuit pitch was 2 mm.

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